Wafer Dicing Machines
Wafer Dicing Machine
Wafer Dicing Machine cuts the wafers into individual chips one by one. It cuts a silicon wafer by attaching a blade to spindle and make the blade drive in high speed (60,000 rpm).
It is possible to make flexible blades tight by driving the spindle at high speed. And also, it is possible to reduce the cutting width and increase the number of chips per unit area on the silicon wafer.